- Part Status :
- Operating Temperature :
- Package / Case :
-
- 100-LBGA (2)
- 100-LQFP (46)
- 100-TFBGA (28)
- 100-TQFP (6)
- 100-UFBGA (16)
- 100-VFBGA (18)
- 112-TFBGA (2)
- 120-VFBGA (4)
- 144-LFBGA (33)
- 144-LQFP (55)
- 144-TFBGA (12)
- 144-UFBGA (24)
- 145-TFLGA (1)
- 168-UFBGA, WLCSP (3)
- 169-UFBGA (6)
- 176-LQFP (5)
- 176-LQFP Exposed Pad (13)
- 201-UFBGA (6)
- 208-LQFP (5)
- 216-TFBGA (7)
- 256-LBGA (2)
- 257-LFBGA (6)
- 416-BBGA (2)
- 473-LFBGA (8)
- 516-BBGA (1)
- 64-LQFP (18)
- 64-TQFP (8)
- 64-VFQFN Exposed Pad (8)
- 64-WFQFN Exposed Pad (8)
- Supplier Device Package :
-
- 100-LQFP (14x14) (46)
- 100-MAPBGA (11x11) (2)
- 100-TFBGA (9x9) (44)
- 100-TQFP (14x14) (6)
- 100-VFBGA (7x7) (18)
- 112-BGA (10x10) (2)
- 120-BGA (7x7) (4)
- 144-LFBGA (10x10) (33)
- 144-LQFP (15x15) (3)
- 144-LQFP (20x20) (52)
- 144-TFBGA (10x10) (12)
- 144-UFBGA (6x6) (24)
- 145-TFLGA (7x7) (1)
- 168-WLCSP (4.89x5.69) (3)
- 169-UFBGA (7x7) (6)
- 176+25UFBGA (10x10) (4)
- 176-LQFP (24x24) (16)
- 176-LQFP (26x26) (2)
- 176-UFBGA (10x10) (2)
- 208-LQFP (28x28) (5)
- 216-TFBGA (13x13) (7)
- 256-MAPPBGA (17x17) (2)
- 257-MAPBGA (14x14) (6)
- 416-PBGA (27x27) (2)
- 473-MAPBGA (19x19) (8)
- 516-FPBGA (27x27) (1)
- 64-LQFP (10x10) (18)
- 64-QFN (9x9) (16)
- 64-TQFP (10x10) (8)
- Peripherals :
-
- Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT (43)
- Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT (222)
- Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT (20)
- Brown-out Detect/Reset, DMA, POR, PWM, WDT (26)
- DMA, I²S, LCD, PWM, WDT (1)
- DMA, I²S, POR, WDT (19)
- DMA, LVD, POR, PWM, WDT (5)
- DMA, LVD, POR, WDT (12)
- DMA, POR, PWM (3)
- DMA, POR, PWM, WDT (10)
- Core Size :
- Connectivity :
-
- CAN, CSIO, I²C, LIN, UART/USART (2)
- CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI (10)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB (15)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB (49)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, SAI, SDIO, SPI, UART/USART, USB, USB OTG (39)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB (3)
- CAN, EBI/EMI, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB (8)
- CAN, EBI/EMI, I²C, IrDA, LIN, SAI, SDIO, SPI, UART/USART, USB, USB OTG (4)
- CAN, EBI/EMI, I²C, IrDA, LIN, SmartCard, SPI, UART/USART (28)
- CAN, EBI/EMI, SCI, SPI (3)
- CAN, Ethernet, FlexRay, LIN, SPI, UART/USART (12)
- CAN, Ethernet, FlexRay, I²C, LIN, SPI (19)
- CAN, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB (16)
- CAN, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB (28)
- CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB (8)
- CAN, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB (8)
- EBI/EMI, Ethernet, I²C, SD/SDHC/SDIO, SmartCard, SPI, UART/USART, USB (1)
- EBI/EMI, I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB (40)
- I²C, IrDA, LIN, MMC/SD/SDIO, SPI, UART/USART, USB (50)
- I²C, IrDA, LIN, SPI, UART/USART, USB (18)
- Program Memory Type :
- EEPROM Size :
- Applied Filters :
361 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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GET PRICE |
2,969
In-stock
|
Microchip Technology | IC MCU 32BIT 1MB FLASH 64LQFP | SAM S70 | Active | Tray | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | Brown-out Detect/Reset, DMA, POR, PWM, WDT | ARM® Cortex®-M7 | 300MHz | 1.08 V ~ 3.6 V | 44 | 384K x 8 | 32-Bit | I²C, IrDA, LIN, SPI, UART/USART, USB | 1MB (1M x 8) | Flash | - | A/D 5x12b, D/A 1x12b | Internal | ||
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1,535
In-stock
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 516FBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,536
In-stock
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 416BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,642
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,205
In-stock
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NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 473BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | |||
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2,280
In-stock
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NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 473BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | |||
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1,084
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | |||
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3,979
In-stock
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NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 473BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | |||
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3,318
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 22x12b | Internal | |||
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3,132
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | |||
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3,755
In-stock
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NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 473BGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | |||
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909
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 22x12b | Internal | |||
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908
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL CORE POWER | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,210
In-stock
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NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 180 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,287
In-stock
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,303
In-stock
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NXP USA Inc. | IC MCU 32BIT 2.5MB FLASH 144LQFP | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | 79 | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,182
In-stock
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,655
In-stock
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NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 180 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,215
In-stock
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NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 150 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 150MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,582
In-stock
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NXP USA Inc. | SINGLE CORE, 3M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,365
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,163
In-stock
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,784
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,551
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL CORE 3MB FLA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,975
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,869
In-stock
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tray | -40°C ~ 135°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,606
In-stock
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | - | -40°C ~ 125°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,470
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,178
In-stock
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STMicroelectronics | LQFP 176 24X24X1.4 | STM32F4 | Active | Tray | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M4 | 180MHz | 1.7 V ~ 3.6 V | 131 | 384K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, SAI, SDIO, SPI, UART/USART, USB, USB OTG | 2MB (2M x 8) | Flash | - | A/D 16x12b, D/A 2x12b | Internal | |||
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1,639
In-stock
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STMicroelectronics | LQFP 176 24X24X1.4 | STM32F4 | Active | Tray | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M4 | 180MHz | 1.7 V ~ 3.6 V | 131 | 384K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, SAI, SDIO, SPI, UART/USART, USB, USB OTG | 2MB (2M x 8) | Flash | - | A/D 16x12b, D/A 2x12b | Internal |
