- Series :
- Part Status :
- Operating Temperature :
- Package / Case :
- Supplier Device Package :
- RAM Size :
8 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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GET PRICE |
3,464
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC51xx | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||
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GET PRICE |
1,813
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5123 | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||
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GET PRICE |
2,586
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5121e | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||
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3,547
In-stock
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NXP USA Inc. | TELEMATICS PROCESSOR W/O MBX GRA | MPC5123 | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | |||
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1,607
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5123 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | |||
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1,578
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516TEPBGA | MPC5121e | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | |||
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1,521
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5121e | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | |||
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3,275
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | MPC51xx | Active | Tray | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External |
