- Packaging :
- Package / Case :
- Supplier Device Package :
19 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
1,724
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
2,808
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
3,518
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
3,246
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
1,500
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
3,807
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
1,572
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
3,739
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
2,078
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
3,427
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
1,835
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
1,411
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
3,930
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
3,374
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
701
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
1,084
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
|
3,258
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
2,321
In-stock
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 416BGA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
|
|
1,195
In-stock
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 516BGA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal |
