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- Part Status :
- Packaging :
- Operating Temperature :
- Peripherals :
- Core Processor :
- Speed :
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26 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
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GET PRICE |
1,458
In-stock
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Infineon Technologies | IC MCU 32BIT 64KB FLASH 64LQFP | XMC4000 | Discontinued at Digi-Key | Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, I²S, LED, POR, PWM, WDT | ARM® Cortex®-M4 | 80MHz | 3.13 V ~ 3.63 V | 35 | 20K x 8 | 32-Bit | CAN, I²C, LIN, SPI, UART/USART, USB | 64KB (64K x 8) | Flash | - | A/D 10x12b; D/A 2x12b | Internal | |||
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1,355
In-stock
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XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 400MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 6-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
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3,702
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 64 | S12 MagniV | Active | Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 4K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 64KB (64K x 8) | Flash | 1K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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2,661
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 19 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 12K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 192KB (192K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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3,599
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 12 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 8K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 128KB (128K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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3,083
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 12 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 8K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 128KB (128K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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3,177
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 96 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 8K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 96KB (96K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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1,445
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 64 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 4K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 64KB (64K x 8) | Flash | 1K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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3,339
In-stock
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XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | 0°C ~ 70°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 500MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 8-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
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3,185
In-stock
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XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 400MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 8-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
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3,787
In-stock
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XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | 0°C ~ 70°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 400MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 8-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
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858
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 19 | Automotive, AEC-Q100, S12 MagniV | Active | Tray | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 12K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 192KB (192K x 8) | Flash | 2K x 8 | A/D 16x12b, D/A 1x8b | Internal | ||||
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983
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 19 | S12 MagniV | Active | Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 12K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 192KB (192K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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3,917
In-stock
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XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 500MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 6-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
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2,545
In-stock
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NXP USA Inc. | IC MCU 16BIT 64KB FLASH 64LQFP | Automotive, AEC-Q100, S12 MagniV | Active | Tray | -40°C ~ 150°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 4K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 64KB (64K x 8) | Flash | 1K x 8 | A/D 16x12b, D/A 1x8b | Internal | ||||
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1,961
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 19 | S12 MagniV | Active | Tray | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 12K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 192KB (192K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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1,274
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 12 | S12 MagniV | Active | Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 8K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 128KB (128K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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1,524
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 12 | S12 MagniV | Active | Tray | -40°C ~ 105°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 8K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 128KB (128K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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2,232
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 96 | S12 MagniV | Active | Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 8K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 96KB (96K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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2,726
In-stock
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NXP USA Inc. | MAGNIV 16-BIT MCU S12Z CORE 19 | S12 MagniV | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 12K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 192KB (192K x 8) | Flash | 2K x 8 | A/D 16x10b, D/A 1x8b | Internal | ||||
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1,707
In-stock
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NXP USA Inc. | IC MCU 16BIT 192KB FLASH 64LQFP | S12 MagniV | Active | Tray | -40°C ~ 125°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | DMA, POR, PWM, WDT | S12Z | 32MHz | 3.5 V ~ 40 V | 42 | 12K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 192KB (192K x 8) | Flash | 2K x 8 | A/D 16x12b, D/A 1x8b | Internal | ||||
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1,972
In-stock
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XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 500MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 8-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
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1,201
In-stock
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XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | 0°C ~ 70°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 400MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 6-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
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2,561
In-stock
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XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | 0°C ~ 70°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 500MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 8-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
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1,390
In-stock
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XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | 0°C ~ 70°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 400MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 8-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External | ||||
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3,373
In-stock
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XMOS | IC MCU 32BIT 64KB SRAM 64LQFP | XS1 | Active | Tray | 0°C ~ 70°C (TA) | 64-LQFP Exposed Pad | 64-LQFP (10x10) | - | XCore | 500MIPS | 0.95 V ~ 3.6 V | 36 | - | 32-Bit 6-Core | Configurable | 64KB (16K x 32) | SRAM | - | - | External |