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- Operating Temperature :
- Supplier Device Package :
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20 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,305
In-stock
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NXP USA Inc. | IC MCU 32BIT 2MB FLASH 324TEBGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 238 | 80K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 2MB (2M x 8) | Flash | A/D 40x12b | External | |||
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2,639
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | A/D 40x12b | Internal | |||
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1,774
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | A/D 40x12b | Internal | |||
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3,848
In-stock
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NXP USA Inc. | IC MCU 32BIT 3MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 3MB (3M x 8) | Flash | A/D 40x12b | Internal | |||
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1,357
In-stock
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NXP USA Inc. | IC MCU 32BIT 1.5KB FLASH 324BGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 220 | 64K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 1.5KB (1.5K x 8) | Flash | A/D 40x12b | External | |||
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3,637
In-stock
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NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 324BGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 220 | 64K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 1.5MB (1.5M x 8) | Flash | A/D 40x12b | External | |||
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2,955
In-stock
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NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 324BGA | MPC55xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 220 | 64K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 1.5MB (1.5M x 8) | Flash | A/D 40x12b | External | |||
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817
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 80MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | A/D 40x12b | Internal | |||
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1,635
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 3MB (3M x 8) | Flash | A/D 40x12b | Internal | |||
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1,587
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | A/D 40x12b | Internal | |||
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3,508
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 324BGA | MPC51xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-PBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | External | |||
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2,477
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | MPC51xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | External | |||
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2,349
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | A/D 40x12b | Internal | |||
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2,421
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | A/D 40x12b | Internal | |||
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3,161
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 80MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | A/D 40x12b | Internal | |||
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1,118
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | A/D 40x12b | Internal | |||
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3,536
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 3MB (3M x 8) | Flash | A/D 40x12b | Internal | |||
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1,975
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 80MHz | 1.14 V ~ 5.25 V | 151 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | A/D 40x12b | Internal | |||
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2,711
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | A/D 40x12b | Internal | |||
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3,275
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | MPC51xx | Active | Tray | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | External |
