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60 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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GET PRICE |
2,580
In-stock
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NXP USA Inc. | IC MCU 32BIT 8MB FLASH 516BGA | MPC57xx | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | ||
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GET PRICE |
3,802
In-stock
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NXP USA Inc. | IC MCU 32BIT 8MB FLASH 416BGA | MPC57xx | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | ||
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GET PRICE |
2,175
In-stock
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NXP USA Inc. | IC MCU 32BIT 8MB FLASH 416BGA | MPC57xx | Obsolete | Tray | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | ||
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GET PRICE |
3,096
In-stock
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 516BGA | MPC57xx | Obsolete | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | ||
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1,040
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | A/D 64x12b | External | |||
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1,535
In-stock
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 516FBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | A/D 64x12b | Internal | |||
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3,208
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | A/D 64x12b | External | |||
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673
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | A/D 64x12b | External | |||
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3,618
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | A/D 64x12b | External | |||
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3,873
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | A/D 64x12b | External | |||
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1,497
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 516BGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | A/D 64x12b | External | |||
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3,195
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 416BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, SCI, SPI | 4MB (4M x 8) | Flash | A/D 64x12b | External | |||
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3,498
In-stock
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NXP USA Inc. | 4M FLASH 256K RAM Z7 264MHZ | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, SCI, SPI | 4MB (4M x 8) | Flash | A/D 64x12b | External | |||
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1,949
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, SCI, SPI | 4MB (4M x 8) | Flash | A/D 64x12b | External | |||
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1,119
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, SCI, SPI | 4MB (4M x 8) | Flash | A/D 64x12b | External | |||
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1,068
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, SCI, SPI | 4MB (4M x 8) | Flash | A/D 64x12b | External | |||
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2,562
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 3MB (3M x 8) | Flash | A/D 64x12b | External | |||
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2,536
In-stock
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 416BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | A/D 64x12b | Internal | |||
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3,642
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | A/D 64x12b | Internal | |||
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1,122
In-stock
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NXP USA Inc. | IC MCU 32BIT 3MB FLASH 416BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | A/D 64x12b | External | |||
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2,893
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 3MB (3M x 8) | Flash | A/D 64x12b | External | |||
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2,238
In-stock
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NXP USA Inc. | 3M FLASH 256K RAM Z7 200MHZ | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | A/D 64x12b | External | |||
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2,079
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | A/D 64x12b | External | |||
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2,219
In-stock
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NXP USA Inc. | 3M FLASH 256K RAM Z7 200MHZ | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | A/D 64x12b | External | |||
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2,873
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 200MHz | 1.08 V ~ 5.25 V | 32 | 192K x 8 | 32-Bit | CAN, SCI, SPI | 3MB (3M x 8) | Flash | A/D 64x12b | External | |||
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2,020
In-stock
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NXP USA Inc. | NXP 32-BIT MCU QUAD POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 512-FBGA | 512-TEPBGA (25x25) | DMA, LVD, POR, Zipwire | e200z7 | 300MHz | 3 V ~ 5.5 V | - | 404K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexRAY, I²C, LIN, SPI, PSI, UART/USART | 8.64MB (8M x 8) | Flash | A/D 12b SAR, 16b Sigma-Delta | Internal | |||
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2,459
In-stock
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NXP USA Inc. | NXP 32-BIT MCU QUAD POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 300MHz | 3 V ~ 5.5 V | - | 404K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexRAY, I²C, LIN, SPI, PSI, UART/USART | 8.64MB (8M x 8) | Flash | A/D 12b SAR, 16b Sigma-Delta | Internal | |||
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1,724
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
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2,808
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal | |||
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3,518
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | A/D 16b Sigma-Delta, eQADC | Internal |
