- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
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3 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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3,897
In-stock
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CUI Inc. | HEAT SINK, EXTRUSION, TO-220, 25 | HSE | Active | Aluminum Alloy | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.378" (35.00mm) | - | TO-220 | PC Pin | 0.500" (12.70mm) | 5.5W @ 75°C | 8.36°C/W @ 200 LFM | 13.64°C/W | Black Anodized | ||||
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1,450
In-stock
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CUI Inc. | HEAT SINK, EXTRUSION, TO-220, 25 | HSE | Active | Aluminum Alloy | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.378" (35.00mm) | - | TO-220 | PC Pin | 0.500" (12.70mm) | 5.2W @ 75°C | 4.42°C/W @ 200 LFM | 14.42°C/W | Black Anodized | ||||
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2,215
In-stock
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CUI Inc. | HEAT SINK, EXTRUSION, TO-220, 25 | HSE | Active | Aluminum Alloy | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.378" (35.00mm) | - | TO-220 | PC Pin | 0.500" (12.70mm) | 5.5W @ 75°C | 4.39°C/W @ 200 LFM | 13.64°C/W | Black Anodized |