- Part Status :
- Packaging :
- Operating Temperature :
- Package / Case :
- Connectivity :
-
- ASC, CAN, FlexRay, MLI, MSC, SSC (2)
- CAN, CSI, EBI/EMI, I²C, LIN, UART/USART (2)
- CAN, CSIO, I²C, LIN, UART/USART (2)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG (11)
- CAN, EBI/EMI, I²C, SCI, SPI (1)
- CAN, I²C, LIN, SCI, SPI (2)
- CAN, I²C, LIN, SCI, SPI, UART/USART (1)
- CSI, EBI/EMI, I²C, UART/USART (5)
- FIFO, I²C, LPC, SCI, SmartCard (5)
- Program Memory Type :
- EEPROM Size :
- Oscillator Type :
- Applied Filters :
63 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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GET PRICE |
3,778
In-stock
|
Renesas Electronics America | IC MCU 32BIT 256KB FLASH 144LQFP | V850ES/Fx3 | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | - | DMA, LVD, POR, PWM, WDT | V850ES | 32MHz | 3.3 V ~ 5.5 V | 128 | 16K x 8 | 32-Bit | CAN, CSI, EBI/EMI, I²C, LIN, UART/USART | 256KB (256K x 8) | Flash | - | A/D 24x10b | Internal | |||
|
GET PRICE |
3,165
In-stock
|
Renesas Electronics America | IC MCU 16BIT 160KB FLASH 176BGA | H8® H8S/2100 | Active | Tray | -20°C ~ 75°C (TA) | 176-LFBGA | 176-LFBGA (13x13) | POR, PWM, WDT | H8S/2600 | 20MHz | 3 V ~ 3.6 V | 128 | 8K x 8 | 16-Bit | FIFO, I²C, LPC, SCI, SmartCard | 160KB (160K x 8) | Flash | - | A/D 16x10b | External | |||
|
GET PRICE |
985
In-stock
|
Renesas Electronics America | IC MCU 32BIT 512KB FLASH 144LQFP | V850ES/Hx3 | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | - | DMA, LVD, PWM, WDT | V850ES | 32MHz | 3.7 V ~ 5.5 V | 128 | 32K x 8 | 32-Bit | CSI, EBI/EMI, I²C, UART/USART | 512KB (512K x 8) | Flash | - | A/D 24x10b | Internal | |||
|
GET PRICE |
1,480
In-stock
|
Renesas Electronics America | IC MCU 32BIT 768KB FLASH 144LQFP | V850ES/Jx3 | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | - | DMA, LVD, PWM, WDT | V850ES | 32MHz | 2.85 V ~ 3.6 V | 128 | 60K x 8 | 32-Bit | CSI, EBI/EMI, I²C, UART/USART | 768KB (768K x 8) | Flash | - | A/D 16x10b; D/A 2x8b | Internal | |||
|
GET PRICE |
1,942
In-stock
|
Renesas Electronics America | IC MCU 32BIT 512KB FLASH 144LQFP | V850ES/Jx3 | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | - | DMA, LVD, PWM, WDT | V850ES | 32MHz | 2.85 V ~ 3.6 V | 128 | 40K x 8 | 32-Bit | CSI, EBI/EMI, I²C, UART/USART | 512KB (512K x 8) | Flash | - | A/D 16x10b; D/A 2x8b | Internal | |||
|
GET PRICE |
1,150
In-stock
|
Renesas Electronics America | IC MCU 32BIT 384KB FLASH 144LQFP | V850ES/Jx3 | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | - | DMA, LVD, PWM, WDT | V850ES | 32MHz | 2.85 V ~ 3.6 V | 128 | 32K x 8 | 32-Bit | CSI, EBI/EMI, I²C, UART/USART | 384KB (384K x 8) | Flash | - | A/D 16x10b; D/A 2x8b | Internal | |||
|
759
In-stock
|
NXP USA Inc. | IC MCU 32BIT 2MB FLASH 176LQFP | MPC56xxS Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 125MHz | 3 V ~ 5.5 V | 128 | 1.064M x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 16x10b | Internal | ||||
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3,278
In-stock
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XMOS | IC MCU 32BIT 2MB FLASH 236FBGA | XLF | Active | Tray | -40°C ~ 85°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 2000MIPS | 0.95 V ~ 3.6 V | 128 | 512K x 8 | 32-Bit 16-Core | - | 2MB (2M x 8) | Flash | - | - | External | ||||
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2,693
In-stock
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Renesas Electronics America | IC MCU 16BIT 160KB FLASH 176BGA | H8® H8S/2100 | Active | Tray | -20°C ~ 75°C (TA) | 176-LFBGA | 176-LFBGA (13x13) | POR, PWM, WDT | H8S/2600 | 20MHz | 3 V ~ 3.6 V | 128 | 8K x 8 | 16-Bit | FIFO, I²C, LPC, SCI, SmartCard | 160KB (160K x 8) | Flash | - | A/D 16x10b | External | ||||
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3,291
In-stock
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NXP USA Inc. | KINETIS K70: 150MHZ CORTEX-M4F G | Kinetis K70 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 150MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 1MB (1M x 8) | Flash | - | A/D 71x16b. D/A 2x12b | Internal | ||||
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2,903
In-stock
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XMOS | IC MCU 32BIT 2MB FLASH 236FBGA | XLF | Active | Tray | 0°C ~ 70°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 2000MIPS | 0.95 V ~ 3.6 V | 128 | 256K x 8 | 32-Bit 12-Core | - | 2MB (2M x 8) | Flash | - | - | External | ||||
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2,706
In-stock
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XMOS | IC MCU 32BIT ROMLESS 236FBGA | XL | Active | Tray | -40°C ~ 85°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 2000MIPS | 0.95 V ~ 3.6 V | 128 | 512K x 8 | 32-Bit 12-Core | - | - | ROMless | - | - | External | ||||
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1,544
In-stock
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XMOS | IC MCU 32BIT 2MB FLASH 236FBGA | XLF | Active | Tray | 0°C ~ 70°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 2000MIPS | 0.95 V ~ 3.6 V | 128 | 512K x 8 | 32-Bit 10-Core | - | 2MB (2M x 8) | Flash | - | - | External | ||||
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1,574
In-stock
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NXP USA Inc. | KINETIS K70: 120MHZ CORTEX-M4F G | Kinetis K70 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 120MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 1MB (1M x 8) | Flash | - | A/D 71x16b. D/A 2x12b | Internal | ||||
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3,891
In-stock
|
XMOS | IC MCU 32BIT ROMLESS 236FBGA | XL | Active | Tray | -40°C ~ 85°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 2000MIPS | 0.95 V ~ 3.6 V | 128 | 256K x 8 | 32-Bit 12-Core | - | - | ROMless | - | - | External | ||||
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2,858
In-stock
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XMOS | IC MCU 32BIT 2MB FLASH 236FBGA | XLF | Active | Tray | 0°C ~ 70°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 2000MIPS | 0.95 V ~ 3.6 V | 128 | 256K x 8 | 32-Bit 10-Core | - | 2MB (2M x 8) | Flash | - | - | External | ||||
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1,182
In-stock
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XMOS | IC MCU 32BIT 1MB FLASH 236FBGA | XLF | Active | Tray | -40°C ~ 85°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 1000MIPS | 0.95 V ~ 3.6 V | 128 | 256K x 8 | 32-Bit 8-Core | - | 1MB (1M x 8) | Flash | - | - | External | ||||
|
3,197
In-stock
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XMOS | IC MCU 32BIT ROMLESS 236FBGA | XL | Active | Tray | -40°C ~ 85°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 2000MIPS | 0.95 V ~ 3.6 V | 128 | 512K x 8 | 32-Bit 10-Core | - | - | ROMless | - | - | External | ||||
|
GET PRICE |
3,110
In-stock
|
Renesas Electronics America | IC MCU 16BIT 160KB FLASH 176BGA | H8® H8S/2100 | Active | Tray | -20°C ~ 75°C (TA) | 176-LFBGA | 176-LFBGA (13x13) | POR, PWM, WDT | H8S/2600 | 20MHz | 3 V ~ 3.6 V | 128 | 8K x 8 | 16-Bit | FIFO, I²C, LPC, SCI, SmartCard | 160KB (160K x 8) | Flash | - | A/D 16x10b | External | |||
|
3,828
In-stock
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XMOS | IC MCU 32BIT ROMLESS 236FBGA | XL | Active | Tray | 0°C ~ 70°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 2000MIPS | 0.95 V ~ 3.6 V | 128 | 512K x 8 | 32-Bit 16-Core | - | - | ROMless | - | - | External | ||||
|
3,058
In-stock
|
XMOS | IC MCU 32BIT 1MB FLASH 236FBGA | XLF | Active | Tray | -40°C ~ 85°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 1000MIPS | 0.95 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit 8-Core | - | 1MB (1M x 8) | Flash | - | - | External | ||||
|
1,816
In-stock
|
XMOS | IC MCU 32BIT ROMLESS 236FBGA | XL | Active | Tray | -40°C ~ 85°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 2000MIPS | 0.95 V ~ 3.6 V | 128 | 256K x 8 | 32-Bit 10-Core | - | - | ROMless | - | - | External | ||||
|
2,399
In-stock
|
XMOS | IC MCU 32BIT ROMLESS 236FBGA | XL | Active | Tray | 0°C ~ 70°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 2000MIPS | 0.95 V ~ 3.6 V | 128 | 256K x 8 | 32-Bit 16-Core | - | - | ROMless | - | - | External | ||||
|
3,477
In-stock
|
XMOS | IC MCU 32BIT ROMLESS 236FBGA | XL | Active | Tray | 0°C ~ 70°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 2000MIPS | 0.95 V ~ 3.6 V | 128 | 512K x 8 | 32-Bit 12-Core | - | - | ROMless | - | - | External | ||||
|
1,256
In-stock
|
XMOS | IC MCU 32BIT ROMLESS 236FBGA | XL | Active | Tray | -40°C ~ 85°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 1000MIPS | 0.95 V ~ 3.6 V | 128 | 256K x 8 | 32-Bit 8-Core | - | - | ROMless | - | - | External | ||||
|
3,974
In-stock
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Renesas Electronics America | IC MCU 32BIT 1MB FLASH 144LQFP | V850ES/Jx3 | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | - | DMA, LVD, PWM, WDT | V850ES | 32MHz | 2.85 V ~ 3.6 V | 128 | 60K x 8 | 32-Bit | CSI, EBI/EMI, I²C, UART/USART | 1MB (1M x 8) | Flash | - | A/D 16x10b; D/A 2x8b | Internal | ||||
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3,504
In-stock
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Infineon Technologies | IC MCU 32BIT 3MB FLASH 292LFBGA | TC17xx | Not For New Designs | - | -40°C ~ 125°C (TA) | - | PG-LFBGA-292 | DMA, POR, WDT | TriCore™ | 200MHz | 1.17 V ~ 3.63 V | 128 | 288K x 8 | 32-Bit | ASC, CAN, FlexRay, MLI, MSC, SSC | 3MB (3M x 8) | Flash | 192K x 8 | A/D 8x10b, 44x12b | External | ||||
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2,280
In-stock
|
XMOS | IC MCU 32BIT ROMLESS 236FBGA | XL | Active | Tray | 0°C ~ 70°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 2000MIPS | 0.95 V ~ 3.6 V | 128 | 256K x 8 | 32-Bit 12-Core | - | - | ROMless | - | - | External | ||||
|
1,815
In-stock
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XMOS | IC MCU 32BIT ROMLESS 236FBGA | XL | Active | Tray | -40°C ~ 85°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 1000MIPS | 0.95 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit 8-Core | - | - | ROMless | - | - | External | ||||
|
3,492
In-stock
|
XMOS | IC MCU 32BIT 1MB FLASH 236FBGA | XLF | Active | Tray | 0°C ~ 70°C (TA) | 236-LFBGA | 236-FBGA (10x10) | - | XCore | 1000MIPS | 0.95 V ~ 3.6 V | 128 | 256K x 8 | 32-Bit 8-Core | - | 1MB (1M x 8) | Flash | - | - | External |