- Series :
- Packaging :
- Operating Temperature :
- Package / Case :
- Supplier Device Package :
- RAM Size :
5 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,547
In-stock
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NXP USA Inc. | TELEMATICS PROCESSOR W/O MBX GRA | MPC5123 | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | |||
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1,578
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516TEPBGA | MPC5121e | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | |||
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3,508
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 324BGA | MPC51xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-PBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | |||
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2,477
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | MPC51xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | |||
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3,275
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | MPC51xx | Active | Tray | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External |
