- Packaging :
2 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,457
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 144TFBGA | LPC2200 | Active | Tray | -40°C ~ 85°C (TA) | 144-TFBGA | 144-TFBGA (12x12) | POR, PWM, WDT | ARM7® | 75MHz | 1.65 V ~ 3.6 V | 76 | 64K x 8 | 16/32-Bit | EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | - | ROMless | A/D 8x10b | Internal | |||
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981
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 144TFBGA | LPC2200 | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 144-TFBGA | 144-TFBGA (12x12) | POR, PWM, WDT | ARM7® | 75MHz | 1.65 V ~ 3.6 V | 76 | 64K x 8 | 16/32-Bit | EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | - | ROMless | A/D 8x10b | Internal |
