- Packaging :
- Operating Temperature :
- Package / Case :
- Supplier Device Package :
- Speed :
- Connectivity :
- Program Memory Size :
7 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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810
In-stock
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NXP USA Inc. | IC MCU 32BIT 2MB FLASH 416BGA | MPC55xx Qorivva | Not For New Designs | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 64K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | External | |||
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3,015
In-stock
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NXP USA Inc. | IC MCU 32BIT 2MB FLASH 416BGA | MPC55xx Qorivva | Not For New Designs | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 64K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | External | |||
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1,652
In-stock
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NXP USA Inc. | IC MCU 32BIT 2MB FLASH 416BGA | MPC55xx Qorivva | Not For New Designs | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 64K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | External | |||
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1,066
In-stock
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NXP USA Inc. | IC MCU 32BIT 2MB FLASH 416BGA | MPC55xx Qorivva | Not For New Designs | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 82MHz | 1.35 V ~ 1.65 V | 256 | 64K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | External | |||
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1,071
In-stock
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NXP USA Inc. | IC MCU 32BIT 1MB FLASH 324TEBGA | MPC55xx Qorivva | Not For New Designs | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z6 | 80MHz | 1.35 V ~ 1.65 V | 220 | 64K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 1MB (1M x 8) | Flash | - | A/D 40x12b | External | |||
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2,022
In-stock
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NXP USA Inc. | IC MCU 32BIT 1MB FLASH 324TEBGA | MPC55xx Qorivva | Not For New Designs | Tray | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z6 | 80MHz | 1.35 V ~ 1.65 V | 192 | 64K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, SCI, SPI | 1MB (1M x 8) | Flash | - | A/D 40x12b | External | |||
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1,242
In-stock
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NXP USA Inc. | IC MCU 32BIT 2MB FLASH 416BGA | MPC55xx Qorivva | Not For New Designs | Tray | -55°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM, WDT | e200z6 | 132MHz | 1.35 V ~ 1.65 V | 256 | 64K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | External |
