- Package / Case :
- Supplier Device Package :
- Core Processor :
- Core Size :
2 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Data Converters | Oscillator Type | |
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1,028
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256LBGA | LPC43xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-LBGA (17x17) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 164 | 282K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | A/D 3x12b, D/A 1x10b | Internal | ||||
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2,137
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC43xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M4/M0/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 282K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, SSC, UART/USART, USB | - | ROMless | A/D 3x12b, D/A 1x10b | Internal |