- Part Status :
- Operating Temperature :
- Package / Case :
- Voltage - Supply (Vcc/Vdd) :
- Connectivity :
-
- ASC, CAN, Ethernet, FlexRay, HSSL, I²C, LIN, MSC, PSI5, QSPI, SENT (3)
- CAN, EBI/EMI, I²C, SCI, SPI (2)
- CAN, Ethernet, FlexRay, I²C, LIN, SPI (2)
- CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG (39)
- CAN, Ethernet, I²C, LIN, SCI, SPI (28)
- CAN, Ethernet, I²C, LIN, SCI, SPI, UART/USART (1)
- I²C, IrDA, SPI, UART/USART (4)
- Program Memory Size :
- EEPROM Size :
- Oscillator Type :
79 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,076
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 147 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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3,994
In-stock
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NXP USA Inc. | IC MCU 32BIT 3MB FLASH 176LQFP | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 147 | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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1,276
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,154
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 512K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,011
In-stock
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NXP USA Inc. | DUAL CORE 6M FLASH 768K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,290
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,356
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 147 | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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3,098
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 147 | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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973
In-stock
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NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 176LQFP | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 147 | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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2,665
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,654
In-stock
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NXP USA Inc. | 32 BITDUAL CORE3M FLASH512K R | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,200
In-stock
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NXP USA Inc. | 32 BITDUAL CORE3M FLASH384 RA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,125
In-stock
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NXP USA Inc. | IC MCU 32BIT 3MB FLASH 176LQFP | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,123
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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961
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 147 | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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3,359
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,694
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 512K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,100
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,619
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 147 | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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1,492
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 147 | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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1,266
In-stock
|
NXP USA Inc. | 32 BITDUAL CORE3M FLASH384 RA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,812
In-stock
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NXP USA Inc. | 32 BITDUAL CORE3M FLASH384 RA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,778
In-stock
|
NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,344
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d, e200z0h | 80MHz/120MHz | 3 V ~ 5.5 V | 147 | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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1,952
In-stock
|
NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,063
In-stock
|
NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,855
In-stock
|
NXP USA Inc. | DUAL CORE 2M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z2, e200z4 | 80MHz, 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,830
In-stock
|
NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,615
In-stock
|
NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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646
In-stock
|
NXP USA Inc. | DUAL CORE 1.5M FLASH | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z2, e200z4 | 80MHz, 160MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal |
