- Manufacture :
- Part Status :
- Packaging :
- Core Processor :
- Voltage - Supply (Vcc/Vdd) :
- Core Size :
- Program Memory Size :
- EEPROM Size :
- Oscillator Type :
41 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,494
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | |||
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2,961
In-stock
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NXP USA Inc. | IC MCU 32BIT 2MB FLASH 473MAPBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | |||
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3,428
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | |||
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3,855
In-stock
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NXP USA Inc. | IC MCU 32BIT 2MB FLASH 473MAPBGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | |||
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3,510
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 22x12b | Internal | |||
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846
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 22x12b | Internal | |||
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2,229
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | |||
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1,897
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 22x12b | Internal | |||
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2,118
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL POWER ARCH | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 512K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 22x12b | Internal | |||
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GET PRICE |
2,701
In-stock
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Texas Instruments | IC MCU 32BIT 4MB FLASH 337NFBGA | RM | Obsolete | Tray | -40°C ~ 105°C (TA) | 337-LFBGA | 337-NFBGA (13x13) | DMA, POR, PWM, WDT | ARM® Cortex®-R5F | 330MHz | 1.14 V ~ 3.6 V | 145 | 512K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, LIN, MibSPI, SCI, UART/USART | 4MB (4M x 8) | Flash | 128K x 8 | A/D 57x10/12b | External | ||
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1,276
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,154
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 512K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,123
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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621
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,359
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,694
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 512K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,778
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,556
In-stock
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NXP USA Inc. | DUAL CORE, 3M FLASH, 384 | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,102
In-stock
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STMicroelectronics | TFBGA 13X13X1.2 216L | STM32F7 | Active | Tray | -40°C ~ 105°C (TA) | 216-TFBGA | 216-TFBGA (13x13) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M7 | 216MHz | 1.7 V ~ 3.6 V | 168 | 512K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG | 2MB (2M x 8) | Flash | - | A/D 24x12b, A/D 2x12b | Internal | |||
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1,083
In-stock
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STMicroelectronics | IC MCU 32BIT 2MB FLASH 176BGA | STM32F7 | Active | - | -40°C ~ 105°C (TA) | - | - | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 216MHz | 1.7 V ~ 3.6 V | 140 | 512K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG | 2MB (2M x 8) | Flash | - | A/D 24x12b, A/D 2x12b | Internal | |||
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2,061
In-stock
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STMicroelectronics | IC MCU 32BIT 1MB FLASH 144LQFP | STM32F7 | Active | Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 216MHz | 1.7 V ~ 3.6 V | 114 | 512K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG | 1MB (1M x 8) | Flash | - | A/D 24x12b, A/D 2x12b | Internal | |||
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908
In-stock
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STMicroelectronics | LQFP 100 14X14X1.4 | STM32F7 | Active | Tray | -40°C ~ 105°C (TA) | 100-LQFP | 100-LQFP (14x14) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 216MHz | 1.7 V ~ 3.6 V | 82 | 512K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG | 1MB (1M x 8) | Flash | - | A/D 16x12b, D/A 2x12b | Internal | |||
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2,221
In-stock
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STMicroelectronics | IC MCU 32BIT 2MB FLASH 216TFBGA | STM32F7 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | - | - | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M7 | 216MHz | 1.7 V ~ 3.6 V | 159 | 512K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG | 2MB (2M x 8) | Flash | - | A/D 24x12b, A/D 2x12b | Internal | |||
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2,926
In-stock
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STMicroelectronics | IC MCU 32BIT 1MB FLASH 100LQFP | STM32F7 | Active | - | -40°C ~ 105°C (TA) | - | - | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M7 | 216MHz | 1.7 V ~ 3.6 V | 82 | 512K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG | 1MB (1M x 8) | Flash | - | A/D 16x12b, D/A 2x12b | Internal | |||
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1,266
In-stock
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STMicroelectronics | IC MCU 32BIT 2MB FLASH 176BGA | STM32F7 | Active | - | -40°C ~ 105°C (TA) | - | - | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M7 | 216MHz | 1.7 V ~ 3.6 V | 132 | 512K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG | 2MB (2M x 8) | Flash | - | A/D 24x12b, A/D 2x12b | Internal | |||
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3,284
In-stock
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STMicroelectronics | TFBGA 13X13X1.2 216L | STM32F7 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 216-TFBGA | 216-TFBGA (13x13) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M7 | 216MHz | 1.7 V ~ 3.6 V | 168 | 512K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, LIN, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART/USART, USB OTG | 1MB (1M x 8) | Flash | - | A/D 24x12b, A/D 2x12b | Internal | |||
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2,098
In-stock
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NXP USA Inc. | 32 BITDUAL CORE4M FLAS | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 324-LFBGA | 324-MAPBGA (19x19) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 246 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,148
In-stock
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NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,753
In-stock
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NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,880
In-stock
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NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal |
