- Series :
- Part Status :
- Packaging :
- Core Processor :
- Speed :
- Voltage - Supply (Vcc/Vdd) :
- RAM Size :
- Core Size :
- Program Memory Size :
- EEPROM Size :
27 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,114
In-stock
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NXP USA Inc. | 32 BIT6MB FLASH768 RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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790
In-stock
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,448
In-stock
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NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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775
In-stock
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NXP USA Inc. | 32 BIT6MB FLASH768 RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,514
In-stock
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NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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621
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,556
In-stock
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NXP USA Inc. | DUAL CORE, 3M FLASH, 384 | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,291
In-stock
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NXP USA Inc. | KINETIS K70: 150MHZ CORTEX-M4F G | Kinetis K70 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 150MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 1MB (1M x 8) | Flash | - | A/D 71x16b. D/A 2x12b | Internal | |||
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1,574
In-stock
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NXP USA Inc. | KINETIS K70: 120MHZ CORTEX-M4F G | Kinetis K70 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 120MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 1MB (1M x 8) | Flash | - | A/D 71x16b. D/A 2x12b | Internal | |||
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GET PRICE |
3,736
In-stock
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NXP USA Inc. | IC MCU 32BIT 1MB FLASH 256MAPBGA | Kinetis K70 | Obsolete | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 150MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 1MB (1M x 8) | Flash | - | A/D 81x16b. D/A 2x12b | Internal | ||
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3,246
In-stock
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NXP USA Inc. | IC MCU 32BIT 512KB FLASH 256BGA | Kinetis K60 | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 120MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 512KB (512K x 8) | Flash | 16K x 8 | A/D 77x16b, D/A 2x12b | Internal | |||
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613
In-stock
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NXP USA Inc. | TRIPLE CORE, 6M FLASH | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,148
In-stock
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NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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815
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,677
In-stock
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NXP USA Inc. | TRIPLE CORE, 6M FLASH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,753
In-stock
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NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,975
In-stock
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NXP USA Inc. | NXP 32-BIT MCU 6MB FLASH 160MH | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,434
In-stock
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NXP USA Inc. | DUAL CORE 6M FLASH 768K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,990
In-stock
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NXP USA Inc. | DUAL CORE 6M FLASH 768K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,185
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,608
In-stock
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NXP USA Inc. | IC MCU 32BIT 1MB FLASH 256MAPBGA | Kinetis K60 | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 120MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 1MB (1M x 8) | Flash | - | A/D 77x16b, D/A 2x12b | Internal | |||
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1,753
In-stock
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NXP USA Inc. | IC MCU 32BIT 512KB FLASH 256BGA | Kinetis K70 | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 150MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 512KB (512K x 8) | Flash | 16K x 8 | A/D 71x16b. D/A 2x12b | Internal | |||
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818
In-stock
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NXP USA Inc. | IC MCU 32BIT 1MB FLASH 256MAPBGA | Kinetis K70 | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 150MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 1MB (1M x 8) | Flash | - | A/D 71x16b. D/A 2x12b | Internal | |||
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3,864
In-stock
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NXP USA Inc. | IC MCU 32BIT 512KB FLASH 256BGA | Kinetis K70 | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 120MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 512KB (512K x 8) | Flash | 16K x 8 | A/D 71x16b. D/A 2x12b | Internal | |||
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3,337
In-stock
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NXP USA Inc. | IC MCU 32BIT 1MB FLASH 256MAPBGA | Kinetis K70 | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 120MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 1MB (1M x 8) | Flash | - | A/D 71x16b. D/A 2x12b | Internal | |||
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2,959
In-stock
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NXP USA Inc. | IC MCU 32BIT 512KB FLASH 256BGA | Kinetis K60 | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 150MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 512KB (512K x 8) | Flash | 16K x 8 | A/D 77x16b, D/A 2x12b | Internal | |||
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729
In-stock
|
NXP USA Inc. | IC MCU 32BIT 1MB FLASH 256MAPBGA | Kinetis K60 | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 150MHz | 1.71 V ~ 3.6 V | 128 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 1MB (1M x 8) | Flash | - | A/D 77x16b, D/A 2x12b | Internal |
