- Series :
- Packaging :
- Supplier Device Package :
- Core Processor :
- EEPROM Size :
- Data Converters :
- Oscillator Type :
44 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,488
In-stock
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NXP USA Inc. | 16-BIT MCU S12X CORE 256KB FLA | HCS12X | Active | Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD, POR, PWM, WDT | HCS12X | 80MHz | 3.15 V ~ 5.5 V | 91 | 16K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 256KB (256K x 8) | Flash | 4K x 8 | A/D 16x12b | External | |||
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3,882
In-stock
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NXP USA Inc. | 16-BIT MCU S12X CORE 256KB FLA | HCS12X | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD, POR, PWM, WDT | HCS12X | 80MHz | 3.15 V ~ 5.5 V | 91 | 16K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 256KB (256K x 8) | Flash | 4K x 8 | A/D 16x12b | External | |||
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3,755
In-stock
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NXP USA Inc. | SINGLE CORE 2M FLASH 256K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,489
In-stock
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NXP USA Inc. | SINGLE CORE 2M FLASH 256K RAM | MPC57xx | Active | - | -40°C ~ 105°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,427
In-stock
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NXP USA Inc. | 32 BIT,2M FLASH,256K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,950
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | |||
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3,408
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | |||
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3,866
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | |||
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1,043
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | |||
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2,139
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | |||
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865
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | |||
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3,620
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | |||
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916
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | |||
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3,418
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | |||
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3,588
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 3MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 3MB (3M x 8) | Flash | - | A/D 24x12b | Internal | |||
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1,030
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 2MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 2MB (2M x 8) | Flash | - | A/D 24x12b | Internal | |||
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1,499
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 2MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 2MB (2M x 8) | Flash | - | A/D 24x12b | Internal | |||
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961
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 2MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 2MB (2M x 8) | Flash | - | A/D 24x12b | Internal | |||
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2,982
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 2MB | MAC57Dxxx | Active | Tray | -40°C ~ 105°C (TA) | 208-LQFP Exposed Pad | 208-LQFP (28x28) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 2MB (2M x 8) | Flash | - | A/D 24x12b | Internal | |||
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646
In-stock
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NXP USA Inc. | DUAL CORE 1.5M FLASH | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z2, e200z4 | 80MHz, 160MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,975
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,943
In-stock
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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832
In-stock
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NXP USA Inc. | DUAL CORE 1.5M FLASH | MPC57xx | Active | - | -40°C ~ 105°C (TA) | - | - | DMA, I²S, POR, WDT | e200z2, e200z4 | 80MHz, 160MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,886
In-stock
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,083
In-stock
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NXP USA Inc. | 16-BIT MCU S12X CORE 384KB FLA | HCS12X | Active | Tray | -40°C ~ 105°C (TA) | 112-LQFP | 112-LQFP (20x20) | LVD, POR, PWM, WDT | HCS12X | 80MHz | 3.15 V ~ 5.5 V | 91 | 20K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 384KB (384K x 8) | Flash | 4K x 8 | A/D 16x12b | External | |||
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3,085
In-stock
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NXP USA Inc. | DUAL CORE 2M FLASH 256K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z2, e200z4 | 80MHz, 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,604
In-stock
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NXP USA Inc. | DUAL CORE 2M FLASH 256K RAM F | MPC57xx | Active | - | -40°C ~ 105°C (TA) | - | - | DMA, I²S, POR, WDT | e200z2, e200z4 | 80MHz, 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,978
In-stock
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | - | -40°C ~ 105°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,029
In-stock
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NXP USA Inc. | 16-BIT MCU S12X CORE 512KB FLA | HCS12X | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 80-QFP | 80-QFP (14x14) | LVD, POR, PWM, WDT | HCS12X | 80MHz | 3.15 V ~ 5.5 V | 59 | 20K x 8 | 16-Bit | CAN, I²C, SCI, SPI | 512KB (512K x 8) | Flash | 4K x 8 | A/D 8x12b | External | |||
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875
In-stock
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NXP USA Inc. | SINGLE CORE 2M FLASH 256K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal |
