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IMAGE PART NO. PRICE QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Packaging Operating Temperature Package / Case Supplier Device Package Peripherals Core Processor Speed Voltage - Supply (Vcc/Vdd) Number of I/O RAM Size Core Size Connectivity Program Memory Size Program Memory Type EEPROM Size Data Converters Oscillator Type
LPC2939FET208,551
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RFQ
999
In-stock
NXP USA Inc. IC MCU 32BIT 768KB FLASH 208LQFP LPC2900 Obsolete Tray -40°C ~ 85°C (TA) 208-LQFP 208-LQFP (28x28) DMA, POR, PWM, WDT ARM9® 125MHz 1.71 V ~ 3.6 V 152 56K x 8 16/32-Bit CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB, USB OTG 768KB (768K x 8) Flash 16K x 8 A/D 24x10b Internal
LPC2930FET208,551
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RFQ
2,973
In-stock
NXP USA Inc. IC MCU 32BIT ROMLESS 208LQFP LPC2900 Obsolete Tray -40°C ~ 85°C (TA) 208-LQFP 208-LQFP (28x28) DMA, POR, PWM, WDT ARM968E-S 125MHz 1.71 V ~ 3.6 V 152 56K x 8 16/32-Bit CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB, USB OTG - ROMless - A/D 24x10b Internal
LPC2927FBD144,551
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RFQ
1,177
In-stock
NXP USA Inc. IC MCU 32BIT 512KB FLASH 144LQFP LPC2900 Obsolete Tray -40°C ~ 85°C (TA) 144-LQFP 144-LQFP (20x20) DMA, POR, PWM, WDT ARM9® 125MHz 1.71 V ~ 3.6 V 104 56K x 8 16/32-Bit CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB 512KB (512K x 8) Flash 16K x 8 A/D 24x10b Internal
R5F61668RD50BGV
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RFQ
3,971
In-stock
Renesas Electronics America IC MCU 32BIT 1MB FLASH 176LFBGA H8® H8SX/1600 Obsolete Tray -40°C ~ 85°C (TA) 176-LFBGA 176-LFBGA (13x13) DMA, LVD, POR, PWM, WDT H8SX 50MHz 3 V ~ 3.6 V 92 56K x 8 32-Bit EBI/EMI, I²C, IrDA, SCI, SmartCard, USB 1MB (1M x 8) Flash - A/D 8x10b; D/A 2x8b External
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