- Packaging :
- Operating Temperature :
- Core Processor :
- Voltage - Supply (Vcc/Vdd) :
- Data Converters :
122 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
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3,703
In-stock
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NXP USA Inc. | 32 BITDUAL CORE4M FLAS | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 324-LFBGA | 324-MAPBGA (19x19) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 246 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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908
In-stock
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NXP USA Inc. | NXP 32-BIT MCU DUAL CORE POWER | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,457
In-stock
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NXP USA Inc. | 2MB NVM 2 X E200Z4 CORES 150MH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 150MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2MB (2M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,956
In-stock
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2MB (2M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,210
In-stock
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NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 180 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,287
In-stock
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,303
In-stock
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NXP USA Inc. | IC MCU 32BIT 2.5MB FLASH 144LQFP | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | 79 | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,182
In-stock
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,364
In-stock
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NXP USA Inc. | 1.5MB NVM 2 X E200Z4 CORES 150 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 150MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,898
In-stock
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NXP USA Inc. | FREESCALE 32-BIT MCU DUAL CORE | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,267
In-stock
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NXP USA Inc. | 1.5MB NVM 2 X E200Z4 CORES 150 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 150MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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793
In-stock
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NXP USA Inc. | 1MB NVM 2 X E200Z4 CORES 180MH | MPC57xx | Active | Tray | -40°C ~ 135°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 128K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1MB (1M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,188
In-stock
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2MB (2M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,655
In-stock
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NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 180 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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623
In-stock
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NXP USA Inc. | 1.5MB NVM 2 X E200Z4 CORES 200 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,215
In-stock
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NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 150 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 150MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,304
In-stock
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NXP USA Inc. | 1.5MB NVM 2 X E200Z4 CORES 200 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,547
In-stock
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NXP USA Inc. | 1MB NVM 2 X E200Z4 CORES 180MH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 135°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 128K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1MB (1M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,657
In-stock
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NXP USA Inc. | 1MB, 128K RAM, 144PIN | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 128K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1MB (1M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,467
In-stock
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NXP USA Inc. | 1.5MB NVM 2 X E200Z4 CORES 200 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,276
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,154
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 512K RAM F | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,011
In-stock
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NXP USA Inc. | DUAL CORE 6M FLASH 768K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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1,290
In-stock
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NXP USA Inc. | DUAL CORE 3M FLASH 384K RAM F | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,178
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,710
In-stock
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NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,613
In-stock
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NXP USA Inc. | 32 BIT DUAL CORE 3M FLASH 512K R | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,665
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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2,542
In-stock
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NXP USA Inc. | 32 BITDUAL CORE3M FLASH384 RA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | |||
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3,654
In-stock
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NXP USA Inc. | 32 BITDUAL CORE3M FLASH512K R | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal |
