- Manufacture :
- Series :
- Packaging :
- Package / Case :
- Supplier Device Package :
- Voltage - Supply (Vcc/Vdd) :
- Core Size :
- Data Converters :
- Oscillator Type :
15 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
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1,011
In-stock
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NXP USA Inc. | DUAL CORE 6M FLASH 768K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,334
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,698
In-stock
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NXP USA Inc. | 32 BIT3M FLASH512K RAM | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 3MB (3M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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896
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/120MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,173
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,731
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/120MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,316
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,151
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/120MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,460
In-stock
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NXP USA Inc. | DUAL CORE 6M FLASH 768K RAM F | MPC57xx | Active | Tray | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,284
In-stock
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Toshiba Semiconductor and Storage | TX FAMILY MCU | TX00 | Active | Tray | -40°C ~ 85°C (TA) | 64-LQFP | 64-LQFP (10x10) | DMA, LVD, POR, WDT | ARM® Cortex®-M0 | 20MHz | 2.7 V ~ 3.6 V | 51 | 16K x 8 | 32-Bit | I²C, SIO, UART/USART | 128KB (128K x 8) | Flash | - | A/D 8x10b | External | ||||
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3,822
In-stock
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Toshiba Semiconductor and Storage | TX FAMILY MCU | TX03 | Active | Tray | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA, LVD, POR, WDT | ARM® Cortex®-M3 | 80MHz | 2.7 V ~ 3.6 V | 59 | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, Microwire, SIO, SPI, SSI, SSP, UART/USART, USB | 512KB (512K x 8) | Flash | - | A/D 8x12b, D/A 2x10b | External | ||||
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1,256
In-stock
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Toshiba Semiconductor and Storage | TX FAMILY MCU | TX03 | Active | Tray | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA, LVD, POR, WDT | ARM® Cortex®-M3 | 64MHz | 2.7 V ~ 3.6 V | 72 | 258K x 8 | 32-Bit | EBI/EMI, I²C, IrDA, Microwire, SIO, SPI, SSI, SSP, UART/USART | 1MB (1M x 8) | Flash | - | A/D 16x12b | External | ||||
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2,486
In-stock
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Toshiba Semiconductor and Storage | TX FAMILY MCU | TX03 | Active | Tray | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA, LVD, POR, WDT | ARM® Cortex®-M3 | 80MHz | 2.7 V ~ 3.6 V | 72 | 66K x 8 | 32-Bit | EBI/EMI, I²C, IrDA, Microwire, SIO, SPI, SSI, SSP, UART/USART | 256KB (256K x 8) | Flash | - | A/D 16x12b | External | ||||
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3,802
In-stock
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Toshiba Semiconductor and Storage | TX FAMILY MCU | TX00 | Active | Tray | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | DMA, LVD, POR, WDT | ARM® Cortex®-M0 | 20MHz | 2.7 V ~ 3.6 V | 85 | 16K x 8 | 32-Bit | I²C, SIO, UART/USART | 128KB (128K x 8) | Flash | - | A/D 8x12b | External | ||||
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3,296
In-stock
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Toshiba Semiconductor and Storage | TX FAMILY MCU | TX00 | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 48-VFQFN Exposed Pad | 48-QFN (7x7) | DMA, LVD, POR, WDT | ARM® Cortex®-M0 | 24MHz | 1.8 V ~ 3.6 V | 32 | 16K x 8 | 32-Bit | I²C, SIO, SPI, UART/USART, USB | 128KB (128K x 8) | Flash | - | A/D 8x10b | External |