- Operating Temperature :
- Package / Case :
- Supplier Device Package :
- RAM Size :
- Program Memory Size :
- Program Memory Type :
- Data Converters :
5 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
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3,078
In-stock
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NXP USA Inc. | IC MCU 32BIT 512KB FLASH 256LBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-LBGA (17x17) | Brown-out Detect/Reset, DMA, I²S, LCD, Motor Control PWM, POR, PWM, WDT | ARM® Cortex®-M3 | 150MHz | 2 V ~ 3.6 V | 80 | 136K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG | 512KB (512K x 8) | Flash | - | A/D 16x10b; D/A 1x10b | Internal | |||
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1,788
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | ARM® Cortex®-M3 | 150MHz | 2 V ~ 3.6 V | 64 | 168K x 8 | 32-Bit | CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG | - | ROMless | - | A/D 12x10b; D/A 1x10b | Internal | |||
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3,818
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | ARM® Cortex®-M3 | 150MHz | 2 V ~ 3.6 V | 64 | 136K x 8 | 32-Bit | CAN, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART | - | ROMless | - | A/D 12x10b; D/A 1x10b | Internal | |||
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1,039
In-stock
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NXP USA Inc. | IC MCU 32BIT 1MB FLASH 256LBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-LBGA (17x17) | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | ARM® Cortex®-M3 | 150MHz | 2 V ~ 3.6 V | 80 | 136K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG | 1MB (1M x 8) | Flash | - | A/D 16x10b; D/A 1x10b | Internal | |||
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2,931
In-stock
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NXP USA Inc. | IC MCU 32BIT 512KB FLASH 256LBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-LBGA (17x17) | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT | ARM® Cortex®-M3 | 150MHz | 2 V ~ 3.6 V | 80 | 136K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG | 512KB (512K x 8) | Flash | - | A/D 16x10b; D/A 1x10b | Internal |
