- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Thermal Resistance @ Forced Air Flow :
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3 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,605
In-stock
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Advanced Thermal Solutions Inc. | HEAT SINK 56MM X 56MM X 31MM | - | Active | Aluminum | Top Mount | Square, Angled Fins | 2.205" (56.00mm) | 2.205" (56.00mm) | LGA | Push Pin | 1.220" (31.00mm) | 1.00°C/W @ 200 LFM | Black Anodized | |||
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1,042
In-stock
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Seeed Technology Co., Ltd | RASPBERRYPI ULTIMATE COOLDUALFAN | - | Active | Aluminum | Top Mount | Rectangular | 2.205" (56.00mm) | 0.985" (25.00mm) | Raspberry Pi | Adhesive | 0.590" (15.00mm) | - | - | |||
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813
In-stock
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Advanced Thermal Solutions Inc. | HEAT SINK 56MM X 56MM X 52MM | - | Active | Aluminum | Top Mount | Square, Fins | 2.205" (56.00mm) | 2.205" (56.00mm) | LGA | Push Pin | 2.047" (52.00mm) | 0.51°C/W @ 200 LFM | Black Anodized |
